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[Forming Technology] Ultra-thin film molded products for electronic material laminates *Technical documentation available

Significantly contributes to improving the yield of products processed by film punching! Introducing ultra-thin film molding technology that functions as an adhesive.

At Shimizu Industries, we are working on the development of ultra-thin film injection molded products as extensive adhesive components. Ultra-thin film injection molded products function as adhesives, placed between layers such as electronic material laminates, and bond through heating and pressurization. 【Features of Ultra-Thin Film Injection Molded Products】 ■ Capable of accommodating complex designs due to injection molding ■ Expected to improve yield when processed with methods such as film punching 【Are you facing any of these issues?】 - Want to incorporate complex designs... - Want to change the thickness in specific areas... - Want to reduce the number of components... - Want to improve yield... *For more details, please refer to the PDF. Feel free to contact us as well.

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  • Thin film injection molded products

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